A few of our publications . . .

M. J. Bozack, "Real-Time Wetting Dynamics and Interfacial Chemistry in Low in Low-Melting, Pb-Free 58Bi-42Sn Solder Paste on Ni-Au," J. Vac. Sci. Technol. A 22 (2004) 2223.

K. W. Bryant and M. J. Bozack, "Monolayer Growth Modes of Nb and Re on 4H-SiC Surfaces" J. Appl. Phys. 97 (2005) 24904.

J. C. Suhling, H. S. Gale, R. W. Johnson, M. N. Islam, T. Shete, P. Lall, M. J. Bozack, J. L. Evans, P. Seto, T. Gupta, and J. R. Thompson, "Thermal Cycling Reliability of Lead Free Chip Resistor Solder Joints," Soldering and Surface Mount Technology 16/2 (2004) 77.

G. T. Flowers, F. Xie, M. J. Bozack, and R. D. Malucci, "Vibration Thresholds for Fretting Corrosion in Electrical Connectors," IEEE Trans. Components and Packaging Technologies 27 (2004) 65.

A. S. Korchev, M. J. Bozack, B. L. Slaten, and G. Mills, "Polymer-Initiated Photogeneration of Silver Nanoparticles in SPEEK/PVA Films:  Direct Metal Photopatterning," J. Am. Chem. Soc. 126 (2004) 10.

Y. Dong, S. Abaci, C. Shannon, and M. J. Bozack, "Self-Assembly and Electrochemical Desorption of Thioctic Acid Monolayers on Gold Surfaces," Langmuir 19 (2003) 8922.

S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith, and M. J. Bozack, "Wetting Characteristics of Pb-free Solder Pastes and Pb-free PWB Finishes," IEEE Transactions on Electronics Packaging Manufacturing, Vol 25, July 2002, 168-184.

R. W. Johnson, M. Palmer, M. J. Bozack and T. Isaac-Smith, "Thermosonic Gold Wire Bonding to Laminate Substrates with Palladium Surface Finishes," IEEE Transactions on Electronics Packaging Manufacturing 22 (1999) 7.

J. Li, M. J. Bozack, R. H. Zee, "Direct Evidence of Segregation of Carbon at Rhenium Surfaces," J. Mat. Sci. 34 (1998) 239.

E. D. Luckowski, J. M. Delucca, J. R. Williams, S. E. Mohney, M. J. Bozack, T. Isaacs-Smith, and J. Crofton, "Improved Ohmic Contact to n-Type 4H and 6H-SiC Using Nichrome," J. Elect. Mat. 27 (1998) 330.

T. N. Oder, J. R. Williams, M. J. Bozack, V. Iyer, S. E. Mohney, and J. Crofton, "High Temperature Stability of Chromium Boride Ohmic Contacts to p-Type 6H-SiC," J. Elect. Mat. 27 (1998) 324.

C. Dunn, R. Wayne Johnson, M. J. Bozack, C. Kromis, J. Harris, M. Knadler, "Thermosonic Gold Ball Bonding to Alternate Plating Finishes on Laminate MCM Substrates," International Journal of Microelectronics & Electronic Packaging 20 (1997) 317.

C. Dunn, R. W. Johnson, M. J. Bozack, C. Kromis, J. Harris, and M. Knadler, "Assembling MCM's with Alternate Plating Finishes," Electronic Packaging and Production, September, 1997, p. 73-82.

M. J. Bozack, "Surface Studies on SiC as Related to Contacts," Phys. Stat. Sol. B (Berlin) 202 (1997) 549.

(book chapter) M. J. Bozack, "Surface Studies of SiC as Related to Contacts," in Fundamental Questions and Applications of SiC (Springer-Verlag, Berlin, 1997).

J. B. Casady, E. D. Luckowski, M. J. Bozack, D. Sheridan, R. W. Johnson, and J. R. Williams, "Etching of 6H- and 4H-SiC Using HF3 in a Reactive Ion Etching System," J. Electrochem. Soc. 143 (1996) 1750.

J. Crofton, E. D. Luckowski, J. R. Williams, T. Isaacs-Smith, M. J. Bozack, and R. Siergiej, "Specific Contact Resistance as a Function of Doping for n-type 4H and 6H-SiC," in Silicon Carbide and Related Materials 1995 (IOP Publishing, Ltd, 1996) 569.

J. B. Casady, E. D. Luckowski, M. J. Bozack, D. Sheridan, R. W. Johnson, and J. R. Willliams, "Reactive Ion Etching of 6H-SiC Using NF3," in Silicon Carbide and Related Materials 1995 (IOP Publishing, Ltd, 1996) 625.

R. J. Shul, A. J. Howard, S. J. Pearson, C. R. Abernathy, C. B. Vartuli, P. A. Barnes, and M. J. Bozack, "High Rate Electron Cyclotron Resonance Etching of GaN, InN, and AlN," J. Vac. Sci. Technol. 13 (1995) 2016.

J. Crofton, P. McMullin, J. R. Williams, and M. J. Bozack, "A High Temperature Ohmic Contact to N-Type 6H-SiC Using Ni," J. Appl. Phys. 77 (1995) 1317.

R. E. Jones, Jr., P. D. Maniar, A. C. Campbell, R. Moazzami, J. L. Dupuie, R. B. Gregory, M. L. Kottke, M. J. Bozack, J. R. Williams, and J. M. Ferrero, "Materials Interactions in the Integration of PZT Ferroelectric Capacitors," Integrated Ferroelectrics 6 (1995) 81.

M. J. Bozack,  "Single Crystal SiC(0001) by AES," Surf. Sci. Spect. 3 (1995) 86.  

M. J. Bozack, "Single Crystal SiC(0001) by XPS,"" Surf. Sci. Spect. 3 (1995) 82.

M. J. Bozack, J. R. Williams, Z. C. Feng, and R. Jones, "Physical Characterization of Lead Zirconate-Lead Titanate (PbZrO3-PbTiO3) Prepared by the Sol-Gel Process," J. Electrochem. Soc. 142 (1995) 485.

M. J. Bozack, Y. Zhou, and S. D. Worley, "Structural Modifications in the Amino Acid Lysine Induced by Soft X-ray Irradiation," J. Chem. Phys. 100 (1994) 1.

M. J. Bozack and J. D. Perez, "Looming Crisis in Graduate Science Education:  Where are America's Top Science Students," Journal of Science Education and Technology 3 (1994) 57.

M. J. Bozack, "Sputter-Induced Modifications of IrO2 During XPS Measurements," Surf. Sci. Spect. 2 (1994) 123. 

M. J. Bozack, "Physics in the Theological Seminary," J. Evan. Theol. Soc. 35 (1993) 65.  
 
M. J. Bozack, "Interaction of Tungsten Hexafluoride with Si and TiN Surfaces," Thin Solid Films 221 (1992) 55.

M. C. Gibson, J. R. Williams, A. T. Fromhold, W. C. Neely, and M. J. Bozack, "The Interaction of Atomic Oxygen with Thin Copper Films,"  J. Chem. Phy. 96 (1992) 2318.

J. Crofton, P. A. Barnes, and M. J. Bozack, "Quantum Mechanical Tunneling in an Ohmic Contact,"  Am. J. Phys. 60 (1992) 499.

M. J. Bozack and P. R. Davis, "The Production of Ultrapure Liquid Metal Alloys by Surface Segregation," J. Mat. Sci. A150 (1992) 255.

C. S. Pathuwathavithane, J. R. Williams, C. C. Tin, P. A. Barnes, and M. J. Bozack, "An RBS Analysis of the Low Temperature Mass Transport of Au in GaAs," Nucl. Instr. Meths. in Phys. Res. B56/57 (1991) 753.